Layer: 8
Board thickness:2.0mm
Inner Copper thickness:1oz(35µm)
Outer Copper thickness: 1oz(35µm)
Board material: FR4 Normal TG140(shengyi S1141)
Surface finishing:OSP
Min line width:0.1mm
Min line space:0.1mm
Min hole size:0.25mm
Min. Copper thickness in hole wall: 20µm
100% Via plugged with SM
solder mask: Green
Legend:White
Application: consumer electronics
100% E-Test
IPC class 2
RoHS
8-layer PCB with OSP for Consumer Electronics