10-layer PCB with ENIG

Layer: 10
Board thickness:2.0mm
Copper thickness: 1oz(35µm)
Board material: FR4 Normal TG140 SY1141
Surface finishing:ENIG
Min. line width:0.1mm
Min. line space: 0.09mm
Min. hole size :0.2mm
Min. Copper thickness in hole wall: 25.4µm
BGA diameter(PAD): 0.4mm
BGA: 100% Via plugged with SM
solder mask: Green(Japan Brand: Taiyo)
Legend:White
100% E-Test and AOI
IPC class 3
RoHS
10-layer PCB with ENIG