6-layer PCB with HAL LF & Gold finger & Beveling

Layer:6
Board thickness:1.6mm
Inner Copper thickness: 1oz(35µm)
Outer Copper thickness: 1oz(35µm
Board material: FR4 Normal TG135 (KD6160)
Surface finishing:HAL LF +gold finger +beveling
Min line width:0.2mm
Min line space:0.25mm
Min hole size:0.5mm
Min. Copper thickness in hole wall: 20µm
solder mask: Green
Legend:White
Date Code:1602
100% E-Test
IPC class 2
RoHS
6-layer PCB with HAL LF & Gold finger & Beveling